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자료 필터
자료유형
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2018 ~ 2026
2018 2026
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전체 597건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Cation disorder in AgSbTe2 leads to glasslike ultralow lattice thermal conductivity
- Kwon, Soongyu ;
- Yi, Sung ;
- Hyun, Soongkeun ;
- Hodges, James M. ;
- Xia, Yi
- 2026-07
- Physical Review Applied
- AMER PHYSICAL SOC
Article
전기차용 고방열·고내열 에폭시 기반 무가압 Ag 소결 접착제 응용 전력반도체 접합 기술
- 이윤걸 ;
- 김재업 ;
- 안기준 ;
- 김동진 ;
- 유하영 ;
- ... 현승균
- 2026-06
- 마이크로전자 및 패키징학회지
- 한국마이크로전자및패키징학회
Article
Effect of lotus-type porous cu on reliability of ag-sintered joints during thermal cycling
- Kim, Minsu ;
- Tatsumi, Hiroaki ;
- Kim, Sang-Wook ;
- Kim, Ji-Hyun ;
- Hyun, Soong-Keun ;
- 외 1명
- 2026-06
- Materials Letters: X
- ELSEVIER
Article
Zener pinning-induced suppression of dynamic recrystallization in CaO-added AM30 magnesium alloy under hot torsion
- Cho, Chang-Hee ;
- Byun, Dong-Bum ;
- Jung, Taek-Kyun ;
- Kim, Jong-Su ;
- Park, Yoon-Ok ;
- ... Hyun, Soong-Keun ;
- 외 1명
- 2026-05
- International Journal of Material Forming
- SPRINGER FRANCE
Article
Understanding the chlorine adsorption mechanism on carbon surfaces for Li-Cl battery cathodes
- Baek, Suyeon ;
- Hyun, Soong-Keun ;
- Kim, Yongseon
- 2026-03-01
- Acta Materialia
- PERGAMON-ELSEVIER SCIENCE LTD
Article
Enhancing thermal reliability of ceramic substrates using lotus-type porous copper
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Lee, Jinkwan ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-03
- Materials Science in Semiconductor Processing
- ELSEVIER SCI LTD
Article
Mechanical behavior of lotus-type porous Cu/Al2O3 joints fabricated by direct bonded copper
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Kim, Sangyeul ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-02
- Materials Today Communications
- ELSEVIER
Article
AL-DGFVE232B 합금의 MIG 용접 후 열처리 조건에 따른 미세조직 및 기계적 물성에 관한 연구
- 조용재 ;
- 박상훈 ;
- 현승균 ;
- 김상열
- 2026-02
- 대한용접접합학회지
- 대한용접접합학회
Article
Joining of lotus-type porous copper to alumina substrate by direct bonded copper technique
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Lee, Jinkwan ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-02
- Materials Science in Semiconductor Processing
- ELSEVIER SCI LTD
Article
Effect of Pre-Annealing Time of Ti/Ag Metallized Cu Substrate on Ag-Ag Direct Bonding for SiC Die Attach
- Kim, Minseo ;
- Lee, Sangmin ;
- Chen, Chuantong ;
- Cho, Seungmin ;
- Choi, Myung Sik ;
- ... Hyun, Soongkeun ;
- 외 1명
- 2026
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026
- Institute of Electrical and Electronics Engineers Inc.
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