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육아정책연구
ISSN
P 1976-6793
출판사
육아정책연구소 Korea Institute of Child Care & Education
국가
SOUTH KOREA
발행 상태
활성
데이터베이스 수록 정보
KCI 2009-2019 (11년)
KCI 등재 2013-2021 (9년)
KCI 등재후보 2010-2012 (3년)
전체 8건 중 1번부터 8번까지의 결과를 표시합니다.
2026
Article
Thermo-mechanical reliability and scalability of copper-pillar solder-cap interconnects for micro-LEDs
- Kim, Junhyeock ;
- Jeong, Ho-Jung ;
- Geum, Dae-Myeong ;
- Oh, Yong Suk ;
- Park, Min-Su ;
- 외 3명
- 2026-04
- Microelectronics and Reliability
- PERGAMON-ELSEVIER SCIENCE LTD
2025
Article
Evaluation of reliability of lotus-type porous Cu joint soldered by SAC305
- Shin, Jae-Ho ;
- Kim, Keun-Soo ;
- Kim, Sang-Wook ;
- Kim, Jae-Won ;
- Kim, Min-Su ;
- ... Hyun, Soong-Keun
- 2025-12
- Microelectronics and Reliability
- Elsevier Ltd.
2024
Article
Development of eutectic gallium-indium-based transparent conductive electrodes on flexible substrates for touch sensor integration
- Kim, Hongseok ;
- Song, Youngjun ;
- Chang, Sung-pil
- 2024-06
- Microelectronics and Reliability
- Elsevier Ltd.
2022
Article
Wettable flank routable thin MicroLeadFrame for automotive applications (vol 135, 114602, 2022)
- Kim, Byong Jin ;
- Jeon, Hyeongil ;
- Kim, GiJeong ;
- Cho, Nam-Hee ;
- Khim, JinYoung ;
- 외 1명
- 2022-10
- Microelectronics and Reliability
- Elsevier Ltd.
Article
Wettable flank routable thin MicroLeadFrame for automotive applications
- Kim, Byong Jin ;
- Jeon, Hyeongil ;
- Kim, GiJeong ;
- Cho, Nam-Hee ;
- Khim, JinYoung ;
- 외 1명
- 2022-08
- Microelectronics and Reliability
- Elsevier Ltd.
Article
Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad
- Kim, Jungsoo ;
- Park, Dae-Young ;
- Ahn, Byeongjin ;
- Bang, Junghwan ;
- Kim, Min-su ;
- ... Park, Hyun-Soon ;
- 외 2명
- 2022-02
- Microelectronics and Reliability
- Elsevier Ltd.
2020
Article
Analyses on the large size PBGA packaging reliability under random vibrations for space applications
- Kim, Yeong K. ;
- Lee, Seok-min ;
- Hwang, Do-soon ;
- Jang, Seohyun
- 2020-06
- Microelectronics and Reliability
- Elsevier Ltd.
2018
Article
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics
- Choi, Kyeonggon ;
- Yu, Dong-Youl ;
- Ahn, Sungdo ;
- Kim, Kyoung-Ho ;
- Bang, Jung-Hwan ;
- 외 1명
- 2018-07
- Microelectronics and Reliability
- PERGAMON-ELSEVIER SCIENCE LTD